| 1. | Flat - plate ceramic packaged boss kovar
平板型陶瓷外壳凸台可伐结构 |
| 2. | Flat - plate ceramic packaged concave
平板型陶瓷外壳凹台 |
| 3. | The reasons and resolve of plating layer blister on multilayer ceramic package
多层陶瓷外壳电镀层起泡的成因和解决措施探讨 |
| 4. | Standard permissible limits of release of lead or cadmium from ceramic packaging vessel in contact with food
陶瓷包装容器铅镉溶出量允许极限 |
| 5. | Cement type is sealed with special non flame cement in the ceramic package
水泥型电阻是把绕线电阻体放入瓷器框内，用特殊不燃性耐热水泥充填密封而成。 |
| 6. | 2 ) in order to achieve the 10kv isolation - voltage , the ceramic package , which is encapsulated with silicone gel is used
该器件具有结构简单、工作稳定、速度快等特点,在高压工作环境有着广泛的应用前景。 |
| 7. | The element of the pe , ceramic package and glass package circuit are mostly introduced , and the infection of saltfog test for them in theory is analysed
摘要主要讲述了塑封电路、陶封电路和玻璃封装电路的成分，并对盐雾试验对它们的影响进行了理论分析。 |
| 8. | Manufactures metallized ceramic packages for rf microwave devices , multilayer ceramic and organic material ic packages and offers flip - chip , wire - bond semiconductor and electronic plating services
-一家专业研制生产销售系列高稳晶体振荡器和开关电源产品的高科技企业。 |
| 9. | Major producers of electrical and electronic ceramics , engineering ceramics , ceramic thick - film integrated circuits , ceramics molybdenum , manganese , tungsten metal manganese , ceramic packages such as ceramics pieces
主要生产电子电器陶瓷、工程陶瓷、陶瓷厚膜集成电路、陶瓷钼锰、钨锰金属化、陶瓷封装外壳等各种陶瓷瓷件。 |
| 10. | It ' s a method to realize system integration . the hdi substrate is critical to mcm . aluminum nitride ( a1n ) has been considered as a material for ceramic packaging in view of the recent trends in the semiconductor industry toward higher speed , power dissipation and packaging density
Mcm还能够实现电子系统的小型化、高密度化，是实现系统集成的重要途径，在mcm中高密度布线的多层基板技术是实现高密度封装的关键。 |
